Informaticore/SuperPower

Artemis - Stacked Version - Board Layout Review

MantaRayDeeJay opened this issue · 2 comments

MantaRayDeeJay commented

_Review Status : Finished

GLOBAL

Schematic

  • ESD Protection behind the USB connector should be implemented.
  • I think I2C_RTC chip, I2C_IO_expander chip and I2C_Pull-up resistors should be powered by the same 3v3_I2C power.
  • Rename Vbat label by bat+ on the "Battery Protection" sheet to improve reading and avoid any confuse.

Layout

  • Improve ESP32 Antenna clearance area. (See comments on Apollo board Review Ticket)
  • Track loop : Disconnect GND tracks between C11&18 and C10&C16. In this way each "capacitor" group can have a unique link to the ground area by their own VIA.
  • Track loop : Disconnect GND track between U2.2 and U2.3 pins.
  • Track loop : Disconnect some 3v3_I2c tracks and increase some 3v3_I2c tracks width.
  • Track over plane : Remove the Vbat track which is over the Vbat Plane shape.
  • Plane shape : Improve Vbat- plane shape layout.
  • Plane shape : Improve Vbat+ plane shape layout.
  • Plane shape : Improve Inductor L1 plane shapes + Add a GND shield Plane shape
  • Clock Signal : Improve Clearance for the CLK pin of the FLASH chip.
  • I2C bus : Check CLK and Data signal tracks (Improve clearance from others nets as do as possible)
  • Remove Mouting Holes copper area in the ESP32 Antenna clearance area.

DRC Issues

  • Solve GND MouTinG Holes issue. (Hole and Pad size can't be the same if you plan to connect the Mtg Hole to a net)

SilkScreen

  • Ref. Des. string Overlap the copper layer
  • Remove Mouting Hole Ref. Des. String on SilkSreen layer
  • Replace "Artemis" string by "ESP32" on ESP32 board.

3D Package

  • Check File links and 3D files presence for the following packages : SOIC-8, SOP-8, SOP-16, Inductor (L1), Micro-USB and Tactile Switches.

DETAILS

Schematic

  • I2C chips (except for the LC709203 fuel gauge) and I2C Pull-Up resistors should should be powered by the same 3v3_I2C power.
    RTC_to_Vbat+ - with arrows

  • Rename Vbat label by bat+ on the "Battery Protection" sheet to improve reading and avoid any confuse.
    Use_bat+_instead_Vbat - with text

Layout

  • ESP32 Antenna clearance

Top_Bottom_Layers - Antenna_Clearance

DRC Issues

  • "GND" MouTinG Holes issue
    GND_Mtg_Hole_Issue - with arrow

  • Track loop : GND tracks between C11&18 and C10&C16
    Disconnect_C11 C18_from_C10 C16_bis - with cross

  • Track loop : GND track between U2.2 and U2.3 pins.
    FS8205A_Pin2 3_bis - with cross

  • Track loop : Disconnect some 3v3_I2c tracks and increase some 3v3_I2c tracks width.
    3v3_Ic2_3 - with_cross

  • Track over plane : Remove the Vbat track which is over the Vbat Plane shape.
    Vbat_net - with cross

  • Plane shape : Improve Vbat- plane shape layout.
    Vbat- - with comments

  • Plane shape : Improve Vbat+ plane shape layout.
    (1) Path between Battery connector and TP4056 : Remove Loops and improve path width
    Vbat+ - with comments (Loops)
    Vbat+ - Improve Path
    Vbat+ - Improve Path (width)

(2) Utility of Bottom track bridge ? It adds loops, not needed.
Track over plane - with arrows

(3) Power Path on the plane : From Battery connector to TP4056 charger chip, +5V, +3.3V and +3.3V_MCU regulators.
Vbat+ - Power Path

(4) Improve Regulator Power Path
Vbat+ - Improve Regulator Path

  • Plane shape : Improve Inductor L1 plane shapes + Add a GND shield Plane shape
    L1_pin1 - Improvement
    L1_pin2 - Improvement
    L1_Pins - Add GND Shield

  • Clock Signal : Improve Clearance for the CLK pin of the FLASH chip.
    Flash_CLK - Improvement

  • Remove Mouting Holes copper area in the ESP32 Antenna clearance area.
    Artemis - Top View - Remove Mtg Hole copper area

SilkScreen

  • Ref. Des. string Overlap the copper layer
    Artemis - Bottom View - silk ref des overlap

  • Remove Mouting Hole Ref. Des. String on SilkSreen layer
    Artemis - Top View - Remove MTG Hole Silk

  • Replace "Artemis" string by "ESP32" on ESP32 board.
    Artemis - Bottom View - ESP32

3D Packages

  • Check File links and 3D files presence for the following packages : SOIC-8, SOP-8, SOP-16, Inductor (L1), Micro-USB and Tactile Switches.
    3D_Top_View - with border and text
Tobi3566 commented

Some comments on the review points:
ESD: no low cost dev board that i know of has ESD on the usb input and this version is still kinda intended to be lowcost and possible to hand solder

U2: connected the same way basically all charger boards have the mosfet connected (some even have filled plane). also doesn't cause any electrical issues at all

VBat track width: not really possible with the layout and it is also sufficient for the expected current (slightly improved it already)

MantaRayDeeJay commented

@Tobi3566
ESD Protection: why and how to protect microcontrollers efficiently
https://www.youtube.com/watch?v=56eZHBBuvsk
ESD Protection is mandatory