MaslowCNC/Electronics

Heatsink substrate

Closed this issue · 6 comments

JDogHerman commented

I might be wrong in this, but would it be good to add a thermal substrate copper pad for the H-Bridge ICs to sit upon?

BarbourSmith commented

I think it's a great idea. We actually had one in an early version of the PCB, but I took it out because our PCBA people were having enough trouble and I wanted to make things really really really easy for them. It might be time to put that back in. The ground plane runs right under each chip to make doing exactly that easy.

JDogHerman commented

Sorry I opened this and then looked closer at the traces and saw that the traces run underneath the ICs.

dmouw25 commented

Is it possible to Reopen this? These packages are designed to dissipate most of the heat through slug on the bottom of the package. If you notice, the datasheet does not give thermal values for junction to case. You would likely get better thermal performance with a redesigned PCB and no heatsink.

JDogHerman commented

Reopened as a feature request.

blurfl commented

I believe this was addressed in the v1.2 layout. @JDogHerman, @dmouw25 does that look correct to you? If so, we could close this.

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BarbourSmith commented

I second that it was a great suggestion and has been added

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