Remove bottom layer soldermask on PCB edge for proper grounding to case
wm93 opened this issue · 2 comments
wm93 commented
Read through the EEVblog thread regarding the LISN and noticed, that the current layout is missing the soldermask keepout on PCB edge for a proper grounding to the Hammond 1590B case.
Was this intentional or does it require a fix?
bvernoux commented
Yes it is a mistake because the keepout area was not done correctly and I have removed it and it requires to add a mask for better grounding of the case with the PCB on Bottom layer border