Footprints generated from dimensions on manufacturer spec sheets.
The MSP430s have thermal pads that should be connected to the ground layer of the PCB. If thermal relief has been set in the ground layer pour, the clearance may be too large to connect the layer to the small plated through-holes. Set the pad connection to "solid" in the local clearance settings.
All footprints have been verified by reflow soldering components on a PCB and tested for correct operation.
Bosch BME280 pressure-temperature-humidity sensor
Texas Instruments HDC2010 temperature-humidity sensor
Sensirion SHTC3 temperature-humidity sensor
Knowles SPU410 MEMS microphone
TI MSP430F5528 and equivalent 64-pin MCUs
TI MSP430FR5969 and equivalent 48-pin MCUs
TI MSP430FR2355TRSMT and equivalent 32-pin MCUs
TI MSP430FR5994IRGZ and equivalent 48-pin MCUs