/VLSI-Project-

project of VLSI course

Primary LanguageVerilog

Adders and Multipliers Chip

Table of Contents

Part 1: Adders

About

This section explores various 32-bit signed adders implemented in Verilog. The focus is on studying the characteristics of different adder implementations and evaluating their performance. A comprehensive testbench validates each adder, and synthesis is performed with specified constraints.

Overview

This part covers the following adders:

  • Verilog (+) version of adders
  • Ripple Carry Adder
  • Carry Look-Ahead Adder
  • Carry Bypass Adder
  • Carry Select Adder

Test Cases Covered:

  • Overflow of positive numbers.
  • Overflow of negative numbers.
  • Addition of positive and negative numbers.
  • Addition of positive and positive numbers.
  • Addition of negative and negative numbers.
  • Additional 3 random test cases.

then the most appropriate adder was chosen to create a floating-point adder (IEEE-standard).

Part 2: Multipliers

About

In this section, 32-bit signed multipliers are designed and implemented in Verilog. The chosen adder from Part 1 is integrated into the multiplier implementations. A comprehensive testbench is created, and synthesis is performed with specified constraints.

Overview

This part covers the following multipliers:

  • Verilog (*) version of multiplier
  • Multiplier Tree (combinational)
  • Sequential Multiplier using shift & accumulate
  • Booth Algorithm (Original algorithm)

Test Cases Covered:

  • Multiplication of positive and negative numbers.
  • Multiplication of positive and positive numbers.
  • Multiplication of negative and negative numbers.
  • Multiplication of negative and positive numbers.
  • Multiplication by zero.
  • Multiplication by 1.
  • Additional 2 random test cases.

then the most appropriate multiplier was chosen to create a floating-point multiplier (IEEE-standard).

Part 3: Generating Chip

About

This section involves the integration of the Phase One adder and Phase Two multiplier to generate a chip. Synthesis, placement, and routing are performed with specified constraints. Post-routing simulation is conducted, and GDS files are generated for each design.

Overview

This part summarizes the synthesis, placement, routing, post-routing simulation, and GDS file generation processes for the final chip.

Contributors

Menna-Ahmed7
Menna
EmanElbedwihy
Eman
nesma-shafie
Nesma
Sara-Gamal1
Sara