/A500_ACCEL_RAM_IDE-Rev-2

Improved design attempt for Amiga 500 in socket 68000 Accelerator, FastRAM and IDE Interface

Primary LanguageVerilogGNU General Public License v3.0GPL-3.0

A500_ACCEL_RAM_IDE-Rev-2

Improved design attempt for Amiga 500 in socket 68000 Accelerator, FastRAM and IDE Interface

Warning

This design has not been compliance tested and will not be. It may cause damage to your A500. I take no responsibility for this. I accept no responsibility for any damage to any equipment that results from the use of this design and its components. IT IS ENTIRELY AT YOUR OWN RISK!

Overview

The main purpose of this design is to improve on of the Rev 1. As the Rev 1 design was essentially a proof of concept, Rev 2 supports a larger CPLD (95144), SPI Flash, buffered IDE Interface, 2 Spare IO header pins and 2MB SRAM. However, most importantly support for the MC68SEC000 which can be aggressively clocked.

Appearance

Nice 3D model: 3D Model

... and the populated PCB with only 1MB of SRAM (FastRAM) and 128MByte DOM: Populated PCB

My design goals for the Rev 2 design were to:

  1. Use a larger CPLD to contain all the logic (and more) from Rev 1.
  2. Support up to 40MHz with 0 Waitstates.
  3. Support IDE.device (credit to MHeinrichs https://github.com/MHeinrichs) for a simple and quick IDE interface.
  4. Have a SPI interface / SPI Flash for available to eventually support Flash based Kickstarts.

Here is the performance overview at 30MHz: 30 MHz

... and at 40MHz: 40 MHz

BOM

For those wanting to build their own hardware, here is the BOM;

Reference(s) Value Footprint
C101 100nF Capacitors_SMD:C_0603
C102 100nF Capacitors_SMD:C_0603
C103 100nF Capacitors_SMD:C_0603
C104 100nF Capacitors_SMD:C_0603
C105 100nF Capacitors_SMD:C_0603
C106 100nF Capacitors_SMD:C_0603
C107 100nF Capacitors_SMD:C_0603
C112 100nF Capacitors_SMD:C_0805_HandSoldering
C113 100nF Capacitors_SMD:C_0805_HandSoldering
C114 100nF Capacitors_SMD:C_0805_HandSoldering
C201 100nF Capacitors_SMD:C_0805_HandSoldering
C202 100nF Capacitors_SMD:C_0805_HandSoldering
C203 100nF Capacitors_SMD:C_0805_HandSoldering
C204 100nF Capacitors_SMD:C_0805_HandSoldering
C205 100nF Capacitors_SMD:C_0805_HandSoldering
C206 100nF Capacitors_SMD:C_0805_HandSoldering
C207 100nF Capacitors_SMD:C_0805_HandSoldering
IDE_40 CONN_02X20 Pin_Headers:Pin_Header_Straight_2x20_Pitch2.54mm
J1 EXP Pin_Headers:Pin_Header_Straight_1x03_Pitch2.54mm
JTAG1 CONN_01X06 Pin_Headers:Pin_Header_Straight_1x06_Pitch2.54mm
LED201 LED LEDs:LED_0805_HandSoldering
R101 R10K Resistors_SMD:R_0603
R102 R10K Resistors_SMD:R_0603
R201 680R Resistors_SMD:R_0805_HandSoldering
U101 68000D Pin_Headers:Pin_Header_Straight_2x32_Pitch2.54mm
U102 MC68SEC000FN Housings_QFP:LQFP-64_14x14mm_Pitch0.8mm
U103 XC95144XL-TQ100 Housings_QFP:TQFP-100_14x14mm_Pitch0.5mm
U104 AT25_EEPROM Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm
U105 LM1117-3.3 TO_SOT_Packages_SMD:SOT-223
U201 SRAM_512Ko Housings_DIP:DIP-32_W15.24mm_Socket
U202 SRAM_512Ko Housings_DIP:DIP-32_W15.24mm_Socket
U203 SRAM_512Ko Housings_DIP:DIP-32_W15.24mm_Socket
U204 SRAM_512Ko Housings_DIP:DIP-32_W15.24mm_Socket
U205 74HCT245 Housings_SOIC:SO-20_12.8x7.5mm_Pitch1.27mm
U206 74HCT245 Housings_SOIC:SO-20_12.8x7.5mm_Pitch1.27mm
U207 74HCT245 Housings_SOIC:SO-20_12.8x7.5mm_Pitch1.27mm
X101 CXO_DIP14 Oscillators:Oscillator_DIP-14

Regarding the CPU, I purchased from here (I get nothing from this. The parts I received were new and legitimate so I wanted to share the source);

https://www.ebay.de/itm/MC68SEC000FU20-IC-MPU-M680X0-20MHZ-64QFP-NEW/311524970603?hash=item488855d06b:g:qe0AAOSwYIhWleGF

Known Issues And Pending Changes

While populated and debugging Rev 2 naturally issues where found and better ideas came to mind. Also contributions from the Amiga community (http://eab.abime.net/showthread.php?t=89165). The following corrections / improvements are pending the next design iteration:

  1. Change all SMD capacitors and resistors to 0804 packages with hand-soldering footprints to improve soldering.
  2. Correct SPI Flash footprint. Or considering to remove it as I see no immediate benefit.
  3. Increase thermal relief around THD and SMD GND connections to improve soldering (as PCB is 4 layers).
  4. Add 10uF filtering around the power components (+3.3 volt regulator, CPLD and 68SEC000) and add pull-ups/downs on JTAG.
  5. Route PIN 20 of IDE interface to +5V to support DOMs without the need for a power cable.
  6. IDE_IRQ to be routed to the CPLD (additional reason why IDE.device was used). Additionally add IDE_WAIT to the CPLD to have the option to support /DTACK Waitstates.
  7. Add XTAL Clock buffer.
  8. Change RAM Control signals to have /CS tied to GND and connect /OE and /WR to CPLD. RAM access can be faster.
  9. Support a cascaded AutoConfig chain (implemented - still to be tested).