/modular-psu

EEZ Bench Box 3 (BB3) Modular T&M chassis

Primary LanguageAGS ScriptOtherNOASSERTION

GitHub release liberapay

Ownership and License

The contributors are listed in CONTRIB.TXT. This project uses the TAPR v1.0 license, see LICENSE.TXT.

OSHW-HR000002

Introduction

EEZ Bench Box 3 (BB3) represents a new category of modular Test and Measurement (T&M) equipment. It provides a complete open-source hardware and software framework that bridges the gap between – and combines the best features of – DIY hobbyist tools and professional benchtop equipment. BB3 was inspired by the EEZ H24005 power supply project (OSHWA UID HR000001), which attracted many enthusiasts with its broad feature-set, rich user interface, DIY-friendliness, and fully open-source design. It initially comes with two DC power modules (hence the name of repository modular-psu) and will be expanded with new T&M modules (e.g. multi-channel power source, 2/4-quadrant power module, multi-channel temperature sensor module, data logger, switch matrix, digital I/O expander, function generator, data acquisition module, etc.). BB3 is made up of the following components:

  • BP3C EEZ DIB backplane with power output coupling capability of first two modules
  • AUX power supply board with AC input protection, soft-start/power-up control, DC fan controller and +5 V / +12 V power outputs
  • MCU board based on STM32F769IGT6 32-bit ARM Cortex-M7
  • DCP405, 0 - 40 V / 50 mA / 5 A DC power source module
  • DCM220, dual sync buck 0 - 20 V / max. 4 A module
  • Metal enclosure for housing up to 3 modules with 4.3" TFT LCD. Dimensions: 290 (W) x 123 (H) x 240 (D) mm

Supported technologies

Other DIB modules

  • MIO168 Mixed I/O module
  • PREL6 power relays module
  • SMX46 programmable switch matrix module

Related topics and links

The EEZ Bench Box 3 prototype

Enclosure 3D model

Please note that some previous board types and revisions that could be still usable in some cases can be found under previous design folder.