The repository contains several thermal behavioral modeling tools developed by VSCLAB at UC Riverside
gui_sid_rel constains the ThermSubCP tool, which perform the thermal modeling considering realistic power maps
Z. Liu, S. X.-D. Tan, H. Wang, Y. Hua, and A. Gupta,
“Compact thermal modeling for packaged microprocessor design with practical power maps”,
Integration, The VLSI Journal, vol. 47, no. 1, January 2014.
(One of the most downloaded papers in 2014 after its publication, 178 downloads in 3 months)
see: http://www.journals.elsevier.com/integration-the-vlsi-journal/most-downloaded-articles/
Online access: http://www.sciencedirect.com/science/article/pii/S0167926013000412
termal_pof_rel contains ThermPOF too, which is the matrix-pencil based thermal behavioral modeling technique.
D. Li, S. X.-D. Tan, E. H. Pacheco, M. Tirumala, “Architecture-level thermal characterization for
multi-core microprocessors”, IEEE Transactions on Very Large Scale Integrated Systems
(TVLSI), vol. 17, no. 10, pp. 1495-1507, October, 2009.
D. Li, S. X.-D. Tan, E. H. Pacheco, M. Tirumala, “Parameterized architecture-level thermal modeling for multi-core microprocessors”, ACM Transaction on Design Automation of Electronic Systems (TODAES), vol. 15, no. 2, pp.1-22, February 2010 (one of top 10 downloaded ACM TODAES Articles published in 2010).
therm_sid contains ThermSID, which is subspace identification based thermal behavioral modeling technique.
T. Eguia, S. X.-D. Tan, R. Shen, D. Li, E. H. Pacheco, M. Tirumala, L. Wang,
“General parameterized thermal modeling for high-performance microprocessor design”,
IEEE Transactions on Very Large Scale Integrated Systems (TVLSI),
Vol. 20, No. 2, pp.221-224, Feb. 2012. 10.1109/TVLSI.2010.2098054.